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- JOINT IPC/JEDEC STANDARD FOR HANDLING, PACKING, SHIPPING AND USE OF MOISTURE/REFLOW SENSITIVE SURFACE-MOUNT DEVICES
- standard by JEDEC Solid State Technology Association, 12/01/2011
The advent of surface mount devices (SMDs) introduced a new class of quality and reliability concerns regarding damagefrom the solder reflow process, such as cracks and delamination. This document describes the standardized levels of floorlifeexposure for moisture/reflow sensitive SMDs along with the handling, packing, and shipping requirements necessary toavoid moisture/reflow related failures. Companion documents J-STD-020 and J-STD-075 define the classification procedureand JEP113 defines the labeling requirements.
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- 1 file , 500 KB